发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To specify the position of a mounting place of an electronic component from the image of image pickup means arranged while inclining.SOLUTION: An electronic component mounting apparatus includes a component holder for holding an electronic component, first moving means for moving the component holder holding an electronic component above a mounting place determined on a circuit board, second moving means for lowering the component holder, after being moved by the first moving means, toward the mounting place, image pickup means for imaging a range including the mounting place of the circuit board from a direction making an angle for the lowering direction of the component holder by the second moving means, and irradiation means being moved together with the component holder by the first moving means, and irradiating the imaging range of the circuit board by the image pickup means with spot light from a direction parallel with the lowering direction of the component holder by the second moving means.
申请公布号 JP2014212235(A) 申请公布日期 2014.11.13
申请号 JP20130088162 申请日期 2013.04.19
申请人 FUJI MACH MFG CO LTD 发明人 KAWAI HIDETOSHI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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