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发明名称
モバイル装置の放熱構造
摘要
【課題】装置内部の電子部品がスピーディに放熱し、熱がこもらないモバイル装置の放熱構造を提供する。【解決手段】モバイル装置の放熱構造は、キャリア体1を含み、キャリア体はキャリア部11及び熱電冷却チップ12を備え、熱電冷却チップはキャリア部に嵌合する。キャリア部は第一側111及び第二側112を備え、熱電冷却チップは冷面121及び熱面122を備え、熱電冷却チップの冷面及び熱面はそれぞれキャリア部の第一、二側に対応して切り揃えらている。【選択図】図2
申请公布号
JP3194300(U)
申请公布日期
2014.11.13
申请号
JP20140004694U
申请日期
2014.09.03
申请人
发明人
分类号
H05K7/20
主分类号
H05K7/20
代理机构
代理人
主权项
地址
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