MULTILAYER PRINTED CIRCUIT BOARD

摘要

A multilayer PCB comprises vias for power-supply connected to power-supply wiring, vias for ground connected to ground wiring, ball pads for power-supply connected to balls for power-supply connected to power-supply wiring, and ball pads for ground connected to balls for ground connected to ground wiring. The vias for power-supply and the vias for ground are alternately arranged in a first direction. The vias for power-supply and the vias for ground are not alternately arranged in a second direction perpendicular to the first direction. The ball pads for power-supply and the ball pads for ground are alternately arranged in at least one of the first and second directions. Areas where the ball pads for power-supply and the ball pads for ground are provided are arranged on both sides in the second direction of an area where the vias for power-supply and the vias for ground are provided.

主权项

1. A multilayer printed circuit board (PCB) mounting an integrated circuit, comprising:
a plurality of vias for power supply electrically connected to power supply wiring; a plurality of vias for ground electrically connected to ground wiring; a plurality of ball pads for power supply connected to balls for power supply electrically connected to power supply wiring of the integrated circuit; and a plurality of ball pads for ground connected to balls for ground electrically connected to ground wiring of the integrated circuit, wherein while the vias for power supply and the vias for ground are alternately arranged in a first direction, the vias for power supply and the vias for ground are not alternately arranged in a second direction perpendicular to the first direction, the ball pads for power supply and the ball pads for ground are alternately arranged in at least one of the first direction and the second direction, and areas where the ball pads for power supply and the ball pads for ground are provided are arranged on both sides in the second direction of an area where the vias for power supply and the vias for ground are provided.