| 摘要 |
<p>The present invention relates to a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board of the present invention comprises: a first coating layer formation step for forming a first coating layer on one surface of a substrate using conductive ink; a second coating layer formation step for forming a second coating layer on the other surface of the substrate using the conductive ink; a punching step for forming a through-hole by punching the first coating layer, the substrate, and the second coating layer; and a plating step for forming a plating layer by plating the first coating layer, the second coating layer, and an inner wall surface of the through-hole. Accordingly, the present invention provides the method for manufacturing the printed circuit board and the printed circuit board, which: can improve circuit pattern implementation accuracy and electrical properties through a conventional photography process when compared to the limitation of circuit pattern implementation and electric properties in a circuit fabrication process due to the existing printing method; can save base materials; can shorten a manufacturing process; and can improve productivity.</p> |
