发明名称 Ultrasonic Measurement System
摘要 Disclosed is an ultrasonic measurement system that even without additional means for temperature measurement, compensates for a change in a sound speed of an ultrasonic wave in a section whose thickness is to be measured, and assesses a wall thinning state of this section by highly accurate measurement of the thickness.;An ultrasonic transducer 101 includes a piezoelectric element 108. A high-temperature MI cable 102 contains strands 110A, 110B connected to the ultrasonic transducer 101, and further includes a metallic sheath 112. A temperature sensor is contained in the high-temperature MI cable 102, and includes a thermocouple section 114 to which the strands 110A, 110B are connected at one end of each strand. An ultrasonic transmitter/receiver 117 makes the ultrasonic transducer to transmit ultrasonic waves and to receive the waves reflected from the object whose thickness is to be measured. A temperature-measuring instrument 115 uses the temperature sensor to measure temperature of the object 106 whose thickness is to be measured. A signal logger 104 corrects the sound speed of the ultrasonic wave propagating through the object whose thickness is to be measured, by use of information on the temperature measured by the temperature-measuring instrument 115, and then measures the thickness of the object 106.
申请公布号 US2014331771(A1) 申请公布日期 2014.11.13
申请号 US201314081598 申请日期 2013.11.15
申请人 Hitachi-GE Nuclear Energy, Ltd. 发明人 BABA Atsushi;MUSHA Yoshinori;FUSHIMI Atsushi
分类号 G01B17/02;G01K7/02 主分类号 G01B17/02
代理机构 代理人
主权项 1. An ultrasonic measurement system comprising: an ultrasonic transducer with a piezoelectric element; a high-temperature MI cable having a built-in strand connected to the ultrasonic transducer, the cable including a metallic sheath; a temperature sensor contained in the high-temperature MI cable; an ultrasonic transmitter/receiver that makes the ultrasonic transducer to transmit ultrasonic waves and to receive the waves reflected from an object whose thickness is to be measured; a temperature-measuring instrument using the temperature sensor to measure temperature of the object whose thickness is to be measured; and a signal logger configured to compensate for a change in a sound speed of an ultrasonic wave propagating through the object whose thickness is to be measured, by use of information on the temperature measured by the temperature-measuring instrument, and then measure the thickness of the object.
地址 Hitachi-shi JP