| 摘要 |
Provided is a wire bonding apparatus including: a base (11); a bonding head (13) configured to move a capillary (15) in X, Y, and Z directions with respect to the base (11); and a wire-cleaning plasma unit (30). The wire-cleaning plasma unit (30) includes: hollow casings (31a), (31b) in which an inert gas is introduced so that an internal pressure is higher than an atmospheric pressure; holes (33a), (33b) respectively provided in the casings (31a), (31b) so that the wire (21) is inserted therebetween; and electrodes for plasma respectively disposed within the casings (31a), (31b) around circumferences of the holes (33a), (33b). The wire (21) is cleaned by having the wire (21) be inserted into plasma generated within the casings (31a), (31b) in a state in which air is not contained. With this, a surface of the wire used for wire bonding can be effectively cleaned. |
| 主权项 |
1. A wire bonding apparatus, comprising:
a base body; a bonding head configured to move a bonding tool in X, Y, and Z directions with respect to the base body; a wire spool attached to the base body, and configured to feed a wire to the bonding tool; and a wire-cleaning plasma unit disposed between the wire spool and the bonding tool, wherein the wire-cleaning plasma unit comprises:
hollow casings in which an inert gas is introduced, so that an internal pressure is higher than an atmospheric pressure;holes respectively provided in walls of the casings, and face against each other, so that the wire is inserted therebetween; andelectrodes respectively disposed within the walls of the casings around circumferences of the holes, so as to face against each other the holes, and wherein the wire is cleaned by applying current to the electrodes and having the wire be inserted into plasma in a space between the electrodes within the casings generated in a state in which air is not contained. |
