| 摘要 |
<p>The purpose of the present invention is to provide: an insulating composition which has excellent heat resistance, flexibility and withstand voltage properties; a cured product; and an insulated wire which uses this insulating composition. This insulating composition is characterized by containing a low-molecular-weight bismaleimide having a molecular weight of less than 1,000, a high-molecular-weight bismaleimide having a molecular weight of 3,000 or more, and a curing agent. This insulating resin composition may additionally contain a curable polyphenylene ether as a crosslinking component and a phenoxy resin as a resin component.</p> |
