MICROELECTROMECHANICAL DEVICE AND A METHOD OF MANUFACTURING

摘要

A microelectromechanical device that comprises a wafer plate, a group of one or more wafer connector elements, and an electrical distribution layer between them. For reduced device thickness, the wafer plate comprises at least two dies and bonding material that bonds the at least two dies alongside each other to the longitudinal extent of the wafer plate, wherein at least one of the dies is a microelectromechanical die. The electrical distribution layer covers the wafer plate and includes a layer of dielectric material and a layer of conductive material, wherein the layer of conductive material is patterned within the layer of dielectric material for electrical interconnection of the dies and the wafer connector elements. With the new configuration, significantly reduced MEMS device thicknesses are achieved

主权项

1. A microelectromechanical device that comprises a wafer plate, a group of one or more wafer connector elements, and an electrical distribution layer between them, wherein
the wafer plate comprises at least two dies and bonding material that bonds circumferentially the at least two dies alongside each other to the longitudinal extent of the wafer plate, wherein at least one of the dies is a microelectromechanical die; the electrical distribution layer covers the wafer plate and includes at least one layer of dielectric material and at least one layer of conductive material, wherein the layer of conductive material is patterned within the layer of dielectric material for electrical interconnection of the dies and the wafer connector elements; the electrical distribution layer has a first part that covers the at least one microelectromechanical die and regions of bonding material between the microelectromechanical die and adjacent edges of the wafer plate; the group of one or more wafer connector elements are positioned only on the electrical distribution layer in positions outside the first part.