| 摘要 |
<p>A method for detaching a substrate according to the present invention comprises the steps of: (a) seating a process substrate onto a reinforcing substrate for reinforcing the process substrate to support the process substrate; (b) seating the reinforcing substrate onto a chuck member to be chucked; (c) checking the process substrate to a plurality of substrate detaching units disposed at one side of the chuck member; (d) spraying detaching gas toward the process substrate and the reinforcing substrate from a gas spraying unit positioned at the side part of the process substrate and the reinforcing substrate; and (e) allowing the substrate detaching units to space the process substrate apart from the reinforcing substrate such that the process substrate is detached therefrom. [Reference numerals] (120) Control unit</p> |
