| 发明名称 |
LIGHT EMITTING DIODE PACKAGE STRUCTURE |
| 摘要 |
A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip. The package material includes a matrix material, a plurality of first powder particles, and a plurality of second powder particles. The first powder particles and the second powder particles are distributed in the matrix material. Each first powder particle is a wavelength conversion material. Each second powder particle has a shell-like structure. |
| 申请公布号 |
US2014327025(A1) |
申请公布日期 |
2014.11.06 |
| 申请号 |
US201414267919 |
申请日期 |
2014.05.02 |
| 申请人 |
Industrial Technology Research Institute |
发明人 |
Lin Re-Ching;Wen Shih-Yi;Hsu Chen-Peng;Hu Hung-Lieh;Yu Yu-Chen;Hsieh Chia-Fen |
| 分类号 |
H01L33/50 |
主分类号 |
H01L33/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light-emitting diode package structure, comprising:
a package having a chip carrier portion; a light-emitting diode chip disposed on the chip carrier portion of the package; and a package material disposed on the chip carrier portion and covering the light-emitting diode chip, wherein the package material comprises:
a matrix material;a plurality of first powder particles distributed in the matrix material, wherein each first powder particle is a wavelength conversion material; anda plurality of second powder particles distributed in the matrix material, wherein each second powder particle has a shell-like structure. |
| 地址 |
Hsinchu TW |
