发明名称 CONDUCTIVE PASTE
摘要 A conductive paste is provided, which includes 3 wt % to 20 wt % of epoxy resin, 10 wt % to 25 wt % of solvent, 0.3 wt % to 5 wt % of latent curing agent, 3.5 wt % to 35 wt % of flaky metal powder surface-treated by saturated fatty acid, and 35 wt % to 75 wt % of flaky metal powder surface-treated by unsaturated fatty acid.
申请公布号 US2014326929(A1) 申请公布日期 2014.11.06
申请号 US201414221276 申请日期 2014.03.20
申请人 Chi Mei Corporation 发明人 Hsueh Chan-Li;Li Chung-Ping;Cheng Chu-Yun
分类号 H01B1/22 主分类号 H01B1/22
代理机构 代理人
主权项 1. A conductive paste, comprising: an epoxy resin having a content of 3 wt % to 20 wt %; a solvent having a content of 10 wt % to 25 wt %; a latent curing agent having a content of 0.3 wt % to 5 wt %; a flaky metal powder surface-treated by saturated fatty acid having a content of 3.5 wt % to 35 wt %; and a flaky metal powder surface-treated by unsaturated fatty acid having a content of 35 wt % to 75 wt %.
地址 Tainan City TW