| 摘要 |
<p>The present invention relates to a temperature control device controlling the temperature of a process chamber for substrate processing. The device includes: a heat exchanger heat-exchanging coolant heated or cooled in the process chamber for cooling water; a coolant supply line supplying the coolant to the process chamber as its end is connected to the heat exchanger and the other end is connected to the process chamber; a coolant discharging line transferring the coolant circulated in the process chamber to the heat exchanger as its end is connected to the process chamber and the other end is connected to the heat exchanger; a circulation operating unit including a heater heating the coolant transferred through an internal space as the coolant supply line is installed on at least a part of an extended path and includes the internal space connected to the coolant supply line; and a measurement part connected to the coolant supply line and the coolant discharging line to supply the coolant to the coolant supply line and measuring a volume variation according to the temperature of the coolant and the quantity of the coolant supplied to the circulation operating unit. Thus, according to embodiments of the present invention, time to heat the coolant is reduced since the coolant is heated while being transferred. Moreover, in the present invention, not using a high-capacity coolant storage tank, a necessary quantity of coolant is supplied to the coolant supply line and the coolant is heated while being transferred by using the heater installed on the supply line. Thus, a necessary quantity of coolant is supplied to the coolant supply line and heated through the heater so that power consumption to heat the coolant is reduced.</p> |
