Methods of manufacturing microdevices in laminates, lead frames, packages, and printed circuit boards

摘要

Systems and methods for producing micromachined devices, including sensors, actuators, optics, fluidics, and mechanical assemblies, using manufacturing techniques of lead frames, substrates, microelectronic packages, printed circuit boards, flex circuits, and rigid-flex materials. Preferred embodiments comprise using methods from post-semiconductor manufacturing to produce three-dimensional and free-standing structures in non-semiconductor materials. The resulting devices may remain part of the substrate, board or lead frame which can then used as a substrate for further packaging electronic assembly operations. Alternatively, the devices may be used as final components that can be assembled within other devices.

主权项

1. A method of manufacturing a free standing micro-device, comprising:
(a) preparing a first carrier layer, the first carrier layer being a laminate layer; (b) preparing a second carrier layer, the second carrier layer being a laminate layer and being manufactured separately from the first carrier layer; and (c) bonding the first carrier layer to the second carrier layer to produce the free standing micro-device.