发明名称 Vision regeneration assist apparatus and implantable apparatus
摘要 A vision regeneration assist apparatus includes: a substrate including electrodes; a control unit; a mount that is formed from a sintered element made of an insulating material, the mount including through holes; an internal conductor that is to be filled into the through holes of the mount to electrically connect the control unit with wires extending from the electrodes. The internal conductor includes: a first conductive material which is to be filled to a predetermined depth from an opening of the through holes at the upper surface of the mount, the first conductive material which takes at least one type of conductive material, which is not fused at a sintering temperature of the mount; and a second conductive material which is formed from a conductive material that is to be filled into a remaining of the through holes, which faces the substrate, the second conductive material exhibiting biocompatibility.
申请公布号 US8880179(B2) 申请公布日期 2014.11.04
申请号 US201012955971 申请日期 2010.11.30
申请人 Nidek Co., Ltd. 发明人 Shodo Kenzo
分类号 A61N1/375;H05K1/00;H05K1/02;A61F9/08;A61N1/36;A61N1/05 主分类号 A61N1/375
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. A vision regeneration assist apparatus for regenerating a patient's vision by giving an electrical stimulation to cells forming a retina, the apparatus comprising: a substrate including a plurality of electrodes; a control unit that controls an electrical stimulation pulse to be transmitted to the electrodes; a mount that is formed from a ceramic sintered element made of an insulating material forming a hermetic bottom for isolating and sealing the control unit from outside, the mount including: a plurality of through holes formed through the mount in a thickness direction,an upper surface on which the control unit is placed; anda lower surface on which the substrate is placed; an internal conductor that is filled into the through holes of the mount to electrically connect the control unit with wires extending from the electrodes and that includes: a first conductive material which is filled to a predetermined depth from openings of the through holes at the upper surface of the mount, the first conductive material including a primary member which takes at least one type of conductive material, which is not fused at a sintering temperature of the mount, the first conductive material including at least one type of molybdenum, tungsten, and silver, the first conductive material filled to the predetermined depth having a uniform coefficient of thermal expansion approximately equal to a coefficient of thermal expansion of a material forming the mount; anda second conductive material which is formed from a conductive material that is filled into a remaining of the through holes, which faces the substrate and the remaining of the through holes being other than a part in which the first conductive material is filled to the predetermined depth, the second conductive material exhibiting biocompatibility, the second conductive material including one of platinum and gold; andwherein the first conductive material is different from the second conductive material.
地址 Aichi JP