SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

摘要

Provided are a substrate processing system and a substrate processing method, which can process a terminal area of a junction substrate having the terminal area on at least one side, with improved accuracy. The substrate processing system comprises: a first scribe unit (101) which processes a first scribe line (S1) for cutting a substrate (M1) having a single book shape from a mother substrate (M); a first brake unit (102) which obtains the substrate (M1) having a single book shape by braking the mother substrate along the first scribe line (S1); a second scribe unit (103) which processes a second scribe line (S1) for cutting a unit substrate (U) from the substrate (M1) having a single book shape; a second brake unit (104) which obtains each unit substrate (U) by braking the substrate (M1) along the second scribe line (S2); a third scribe unit (105) which processes a third scribe line (S3) for discriminating a terminal area (T) formed on a second substrate with respect to each unit substrate (U) after the division; and a third brake unit (106) which divides an end material portion (E) covering the terminal area by braking each unit substrate along the third scribe line (S3).