Nanosilver conductive paste, especially for high current and high temperature applications

摘要

The invention relates to a conductive nanosilver paste, especially for high current and high temperature applications, applicable in electronics, in particular for depositing by screen printing in the technology of manufacturing layers for applications in electronics, including elastic and printed electronics.
The inventive paste is characterized in that it consists of 80 wt% to 85 wt% of silver nanopowder and 15 wt% to 20wt% of an organic carrier based on polymethyl methacrylate.