| 摘要 |
The present invention relates to an apparatus for sputtering comprising a pair of sputter gun units opposing a substrate, and arranged at a distance away along a circumferential direction, a target mounted to face the sputter gun unit, and a magnetic part equipped in the sputter gun unit to form a magnetic field; and an apparatus for deposition including the same. According to the present invention, the number of processes can be reduced and the costs necessary for process equipment can be reduced when a multi-layered thin film layer is formed. |
