| 摘要 |
This semiconductor device is provided with: a lead frame (2) having a main body section (2a), and a lead terminal section (2b) that is connected to one end side of the main body section (2a); and a semiconductor chip (1), which is mounted on the main body section (2a), and which is electrically connected to the lead frame (2). A reinforcing member is provided in the semiconductor device before injecting a sealing material, said reinforcing member having one end side attached to the lead terminal section (2b), and the other end side attached to the main body section (2a) or a member mounted on the main body section (2a). |
