发明名称 3D VARIABLE RESISTANCE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 A variable resistance memory device includes a plurality of cell gate electrodes extending in a first direction, wherein the plurality of cell gate electrodes are stacked in a second direction that is substantially perpendicular to the first direction. A gate insulating layer surrounds each cell gate electrode of the plurality of cell gate electrodes and a cell drain region is formed on two sides of the each cell gate electrode of the plurality of cell gate electrodes. A channel layer extends in the second direction along the stack of the plurality of cell gate electrodes, and a variable resistance layer contacting the channel layer.
申请公布号 US2014321193(A1) 申请公布日期 2014.10.30
申请号 US201313975639 申请日期 2013.08.26
申请人 SK hynix Inc. 发明人 PARK Nam Kyun
分类号 H01L45/00;G11C13/00;H01L43/02 主分类号 H01L45/00
代理机构 代理人
主权项 1. A variable resistance memory device, comprising: a semiconductor substrate; a common source region formed on the semiconductor layer; a channel layer formed substantially perpendicular to a surface of the semiconductor substrate, the channel layer being selectively connected to the common source region; a plurality of cell gate electrodes formed along a side of the channel layer; a gate insulating layer formed around each cell gate electrode, of the plurality of cell gate electrodes; a cell drain region located between the each cell gate electrode of the plurality of cell gate electrodes; a variable resistance layer formed along another side of the channel layer; and a bit line electrically connected to the channel layer and the variable resistance layer.
地址 Gyeonggi-do KR