CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

摘要

Provided is a circuit substrate, including a glass film (10) forming a rough layer (11) after surface roughness processing, a resin adhesion (20) located the rough layer (11) on either side of the glass film (10), and a metal foil (30) located on the outside of resin adhesion layer (20). The glass film (10), the resin adhesion layer (20) and the metal foil (30) are joined together through suppressing. The circuit substrate employs the glass film (10) which forms a rough layer (11) after surface roughness processing as a carrier material, so that the resin adhesion layer (20) and the surface of the glass film (10) have a good binding force, and the dielectric constant of the circuit substrate has slight difference in the directions of X, Y and Z. Also provided is manufacturing method for a circuit substrate.

主权项

1. A circuit substrate, comprising a glass film with rough layers formed by surface-roughing treatment, resin adhesion layers located on the rough layer of both sides of the glass film, and metal foils located outside of resin adhesion layer, wherein the glass film, the resin adhesion layers and the metal foils are combined by pressing.