METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME

摘要

There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.

主权项

1. A probe board comprising:
a board body formed as a ceramic sintered body; a plurality of first via electrodes formed in the board body, the first via electrodes being filled with a first filling material; and a second via electrode filled with a second filling material having a lower sintering temperature than that of the first filling material.