| 发明名称 |
HIGH-FREQUENCY MODULE |
| 摘要 |
A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding, and an IC chip placed in a cavity provided in the multilayer board. A gap is provided between a side of the IC chip and an inner wall of the cavity. The multilayer board includes a via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding. |
| 申请公布号 |
US2014321069(A1) |
申请公布日期 |
2014.10.30 |
| 申请号 |
US201414328989 |
申请日期 |
2014.07.11 |
| 申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
Gouchi Naoki;Baba Takahiro |
| 分类号 |
H05K1/18;H05K1/11;H05K1/16 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A high-frequency module comprising:
a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding; and an IC chip placed in a cavity provided in the multilayer board, wherein, a gap is provided between a side of the IC chip and an inner wall of the cavity, and the multilayer board includes a first via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding. |
| 地址 |
Kyoto JP |
