| 摘要 |
<p>If attempting to carry out processing or a treatment on a miniature chip-shaped electronic component by accommodating and fixing the component in a chip-shaped electronic component tray, many of such components are excessively miniature, are hard, and also brittle and easily broken, and further, it is extremely difficult to manufacture a tray which can be accommodated and fixed in a chip-shaped electronic component insertion part in a state where a lateral surface of the long side or the short side of the miniature chip-shaped electronic component stands upright on a top surface of the tray. The present invention relates to a chip-shaped electronic component tray manufacturing method that involves the following: causing a second metal sheet-shaped object in which a frame plate is formed to overlap onto a first metal sheet-shaped object in which a bottom surface plate is formed; mounting a movable plate at a movable plate insertion part of the frame plate; causing a third metal sheet in which a cover plate is formed to overlap the metal sheet-shaped objects; and welding the bottom surface plate, the frame plate, and the cover plate at multiple locations using spot welding.</p> |
