INSULATING SUBSTRATE, PROCESS OF MANUFACTURING THE SAME, SEMICONDUCTOR MODULE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve with a simple structure and at low cost insulation properties of an end face of a side face part in an insulating substrate provided with an isolating layer formed by spray coating a ceramic powder to one side surface of a conductive substrate.SOLUTION: A structure of a side face part of the insulating substrate is so configured that a creepage distance of insulation between a conductive base material and a metal member in a state where the metal member is brought in contact with and mounted to a surface of an insulating layer becomes larger than a thickness of the insulating layer.