| 摘要 |
A mounting-completed core parent substrate in which surface mount devices are mounted on both principal surfaces of the core parent substrate including a plurality of the core individual substrates and having a through hole formed in each core individual substrate so as to extend therethrough is formed. Then, resin layers in a partially cured state are formed on both the principal surfaces of the core parent substrate and the resin layers on both the principal surfaces are joined through the through holes so that the resin layers on both principal surfaces of each core individual substrate are joined and integrated to each other at a predetermined region, each core individual substrate being obtained by dividing the core parent substrate. After that, the resin layers are subjected to main curing. Thereafter, the core parent substrate is divided at a predetermined position and separated into the core individual substrates. |
