| 发明名称 | Method for producing a component and device comprising a component | ||
| 摘要 | A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit. | ||
| 申请公布号 | US8872314(B2) | 申请公布日期 | 2014.10.28 |
| 申请号 | US201313920759 | 申请日期 | 2013.06.18 |
| 申请人 | Infineon Technologies AG | 发明人 | Theuss Horst;Auburger Albert;Dangelmaier Jochen;Hirtreiter Josef |
| 分类号 | H01L21/84;H01L23/498;H01L23/31;H01L21/683;H01L21/56;H01L23/495;H01L21/48;H01L23/00 | 主分类号 | H01L21/84 |
| 代理机构 | Dicke, Billig & Czaja, PLLC | 代理人 | Dicke, Billig & Czaja, PLLC |
| 主权项 | 1. A device comprising; at least one component; and a basic substrate, the basic substrate including a surface coated with an electrically conductive layer, wherein the at least one component has at least one integrated circuit enveloped by an encapsulant and the at least one component is arranged on the basic substrate having paper as substrate material. | ||
| 地址 | Neubiberg DE | ||