发明名称 POWER STACK STRUCTURE AND METHOD
摘要 A power conversion apparatus includes plural press-pack power semiconductor devices; plural thermal and electric conducting blocks provided among the plural press-pack power semiconductor devices; and plural bus bars provided among the plural press-pack power semiconductor devices and the plural thermal and electric conducting blocks to form a first column that is clamped under a predetermined mechanical force. The plural bus bars are directly pressed in the first or more columns for electrical connection, at least one of the press-pack power semiconductor devices is sandwiched between two thermal and electrical conducting blocks, and at least one of the bus bars is sandwiched between two thermal and electric conducting blocks. A method for assembling the power conversion apparatus is also provided. The apparatus and the method can provide optimum heat transfer for press-pack power semiconductor devices and minimum commutation loss and stress.
申请公布号 US2014313642(A1) 申请公布日期 2014.10.23
申请号 US201114355748 申请日期 2011.11.04
申请人 GENRERAL ELECTRIC COMPANY 发明人 Zhang Fan;Sheng Junfeng;Zhang Xiaodan;Zhang Richard S.
分类号 H02M7/00;H02B1/56;H02B1/20 主分类号 H02M7/00
代理机构 代理人
主权项 1. A power conversion apparatus, comprising: plural press-pack power semiconductor devices; plural thermal and electric conducting blocks among the plural press-pack power semiconductor devices; and plural bus bars among the plural press-pack power semiconductor devices and the plural thermal and electric conducting blocks to form at least one column comprising a first column clamped under a predetermined mechanical force, wherein: the plural bus bars are directly pressed in the at least one column for electrical connections,at least one of the plural press-pack power semiconductor devices is sandwiched between two of the plural thermal and electric conducting blocks, andat least one of the plural bus bars is sandwiched between two of the plural thermal and electric conducting blocks.
地址 Schenectady NY US