SEMICONDUCTOR PACKAGE USING GLASS AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a fan-out semiconductor package and a manufacturing method thereof and, more specifically, to a fan-out semiconductor package using glass and a manufacturing method thereof capable of realizing miniaturization by reducing the whole thickness while minimizing the productive wharfage of a wafer level fan-out package. In other words, the present invention provides a fan-out semiconductor package and a manufacturing method thereof capable of easily preventing damage to a rewiring layer as the rewiring layer is protected by a protection substrate during a manufacturing process and reducing the whole thickness of the fan-out package by significantly reducing the thickness of molding compound resin.