| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of positioning a semiconductor chip to a case with accuracy, and as a result, of achieving a high dimensional accuracy and a high reliability.SOLUTION: A semiconductor device 1 comprises: a box-shaped conductive case 10 with an opening, which has a bottom face part 11, a lateral face part 12, and a convex-shaped base part 13; a semiconductor chip 20 arranged on an upper surface of the base part 13; a connector 30 arranged on the other surface 24 of the semiconductor chip 20; and a resin 40. A part of the lateral face part 12 of the case 10 configures a first external terminal part 14 to be connected with an external circuit. A connection surface 15 with the external circuit in the first external terminal part 14 and a connection surface 34 with the external circuit in a second external terminal part 32 of the connector 30, are on the same plane. The bottom face part 11, the lateral face part 12, and the base part 13 are integrally formed of the same metal member. |
