发明名称 METHOD FOR MANUFACTURING A FLUID EJECTION DEVICE AND FLUID EJECTION DEVICE
摘要 A method for manufacturing a fluid ejection device, comprising the steps of: providing a first semiconductor body having a membrane layer and a piezoelectric actuator which extends over the membrane layer; forming a cavity underneath the membrane layer to form a suspended membrane; providing a second semiconductor body; making, in the second semiconductor body, an inlet through hole configured to form a supply channel of the fluid ejection device; providing a third semiconductor body; forming a recess in the third semiconductor body; forming an outlet channel through the third semiconductor body to form an ejection nozzle of the fluid ejection device; coupling the first semiconductor body with the third semiconductor body and the first semiconductor body with the second semiconductor body in such a way that the piezoelectric actuator is completely housed in the first recess, and the second recess forms an internal chamber of the fluid ejection device.
申请公布号 US2014313264(A1) 申请公布日期 2014.10.23
申请号 US201414253276 申请日期 2014.04.15
申请人 STMicroelectronics S.r.l. 发明人 Cattaneo Mauro;Campedelli Roberto;Varisco Igor
分类号 B41J2/045 主分类号 B41J2/045
代理机构 代理人
主权项 1. A method for manufacturing a fluid ejection device, the method comprising: forming a first recess in a first semiconductor body by removing selective portions of the first semiconductor body, the first semiconductor body including a membrane layer and a piezoelectric actuator located over the membrane, wherein the selective portions are removed until the membrane layer is reached; forming an intermediate through hole through the membrane layer by removing a selective portion of the membrane layer; providing a second semiconductor body having a first surface and a second surface; forming a second recess in a third semiconductor body; forming an outlet through hole in the third semiconductor body by removing selective portions of the third semiconductor body outside of said second recess, said outlet through hole being a fluid ejection nozzle of the fluid ejection device; coupling together the first and third semiconductor bodies, wherein the coupling includes housing the piezoelectric actuator in the first recess, wherein the intermediate through hole, the first recess, and the outlet through hole are fluidically coupled to each other; and coupling together the first and second semiconductor bodies, wherein the coupling includes forming a chamber inside the fluid ejection device with a first surface of the second semiconductor body facing the first recess.
地址 Agrate Brianza IT
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