发明名称 NON-VOLATILE MEMORY DEVICE INTEGRATED WITH CMOS SOI FET ON A SINGLE CHIP
摘要 A structure and method provided for integrating SOI CMOS FETs and NVRAM memory devices. The structure includes a SOI substrate containing a semiconductor substrate, a SOI layer, and a BOX layer formed between the semiconductor substrate and the SOI layer. The SOI substrate includes predefined SOI device and NVRAM device regions. A SOI FET is formed in the SOI device region. The SOI FET includes portions of the BOX layer and SOI layers, an SOI FET gate dielectric layer, and a gate conductor layer. The structure further includes a NVRAM device formed in the NVRAM device region. The NVRAM device includes a tunnel oxide, floating gate, blocking oxide, and control gate layers. The tunnel oxide layer is coplanar with the portion of the BOX layer in the SOI device region. The floating gate layer is coplanar with the portion of the semiconductor layer in the SOI device region.
申请公布号 US2014312404(A1) 申请公布日期 2014.10.23
申请号 US201313865267 申请日期 2013.04.18
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 Chou Anthony I.;Kumar Arvind
分类号 H01L27/12;H01L27/105 主分类号 H01L27/12
代理机构 代理人
主权项
地址 Armonk NY US