| 发明名称 |
Semiconductor Device Including a Material to Absorb Thermal Energy |
| 摘要 |
A semiconductor device includes a semiconductor chip and a first material including molecules that are configured to absorb thermal energy by reversibly changing a spatial molecular structure of the molecules. |
| 申请公布号 |
US2014312394(A1) |
申请公布日期 |
2014.10.23 |
| 申请号 |
US201313866150 |
申请日期 |
2013.04.19 |
| 申请人 |
INFINEON TECHNOLOGIES AUSTRIA AG |
发明人 |
Mahler Joachim;Otremba Ralf;Hosseini Khalil |
| 分类号 |
H01L23/28;H01L21/56 |
主分类号 |
H01L23/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a semiconductor chip; and a first material comprising molecules that are configured to absorb thermal energy by reversibly changing a spatial molecular structure of the molecules. |
| 地址 |
Villach AT |
