| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide methods for manufacturing a nozzle substrate etc. by which conveyance of the substrate is facilitated and thickness thereof is effectively controlled. <P>SOLUTION: The methods for manufacturing a nozzle substrate includes the steps of: highly precisely thinning a silicon substrate 51 by grinding except peripheral edge portions so as to facilitate conveyance and so on; forming the plurality of nozzle substrates 30 by etching thinned portions, thereby forming at least nozzles 31; and separating the plurality of substrates 30 of the silicon substrate 51 into individual ones by cutting or cleaving them. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
