| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate excellent in bonding to an insulating layer (fluororesin resin layer, resin layer) and an inorganic substrate, and excellent in the heat resistance, the flame retardancy, the dimensional stability, the electrical characteristic and the reliability in a severe environment of the high temperature and high humidity etc. <P>SOLUTION: The multilayer fluororesin substrate is formed by laminating the multilayer fluororesin film obtained by laminating (A) fluororesin layer/(B) polyimide resin layer/(A) fluororesin layer in this order and the substrate that is selected from the group comprising the ceramic substrate, the glass substrate, and the semiconductor substrate. The multilayer fluororesin substrate has the peel strength of the multilayer fluororesin film and the substrate after the multilayer fluororesin substrate of 5 N/cm or more after heat-treated at 250°C for 24 hours. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
