| 发明名称 | Programmable substrate and applications thereof | ||
| 摘要 | An integrated circuit die includes a semiconductor substrate and a plurality of electronic circuits on the semiconductor substrate. The semiconductor substrate is divided into a plurality of regions. A first region of the substrate supports a first type of electronic circuit and has first permittivity, permeability, and conductivity characteristics. A second region of the substrate supports a second type of electronic circuit and has second permittivity, permeability, and conductivity characteristics. | ||
| 申请公布号 | US8866196(B2) | 申请公布日期 | 2014.10.21 |
| 申请号 | US201213600087 | 申请日期 | 2012.08.30 |
| 申请人 | Broadcom Corporation | 发明人 | Alexopoulos Nicolaos G. |
| 分类号 | H01L27/10 | 主分类号 | H01L27/10 |
| 代理机构 | Garlick & Markison | 代理人 | Garlick & Markison ;Garlick Bruce E. |
| 主权项 | 1. An integrated circuit die comprises: a semiconductor substrate; and a plurality of electronic circuits on the semiconductor substrate, wherein the semiconductor substrate is divided into a plurality of regions, wherein a first region of the plurality of regions supports a first type of electronic circuit and the semiconductor substrate has first permittivity, permeability, and conductivity characteristics within the first region and wherein a second region of the plurality of regions supports a second type of electronic circuit and the semiconductor substrate has second permittivity, permeability, and conductivity characteristics within the second region, wherein the semiconductor substrate in the first region includes a substrate material that has a perforated silicon pattern such that first region has a high effective permittivity. | ||
| 地址 | Irvine CA US | ||