发明名称 BONDING APPARATUS
摘要 A bonding apparatus includes a bonding arm which has a receiving portion facing a center axis of a bonding tool; a pair of capillary holding portions in contact with the bonding tool; a pair of piezoelectric elements configured to generate an ultrasonic vibration in contact with the capillary holding portions; and a pressurizing device which has a pressurizing member arranged to face the receiving portion of the bonding arm and a moving device configured to move the pressurizing member toward the receiving portion of the bonding arm. The pressurizing member is moved in a state in which the pair of piezoelectric elements, the pair of capillary holding portions, and the bonding tool are placed between the receiving portion of the bonding arm to cause the bonding arm to hold the pair of capillary holding portion and the bonding tool.
申请公布号 US2014305996(A1) 申请公布日期 2014.10.16
申请号 US201314364059 申请日期 2013.07.23
申请人 KAIJO CORPORATION 发明人 Takanami Shuichi
分类号 B23K20/10 主分类号 B23K20/10
代理机构 代理人
主权项 1. A bonding apparatus comprising: a bonding arm having a receiving portion extending in a direction intersecting a center axis of a bonding tool and facing the center axis of the bonding tool; a pair of capillary holding portions arranged symmetrically with respect to the center axis of the bonding tool and coming into contact with the bonding tool; a pair of piezoelectric elements arranged symmetrically with respect to the center axis of the bonding tool and configured to generate an ultrasonic vibration in contact with the capillary holding portions; a generator configured to drive the piezoelectric elements; and a pressurizing device including a pressurizing member arranged so as to face the receiving portion of the bonding arm with the center axis of the bonding tool interposed therebetween and a moving device configured to move the pressurizing member toward the receiving portion of the bonding arm such that the pressurizing member is moved in a state in which the pair of piezoelectric elements, the pair of capillary holding portions, and the bonding tool are placed between the receiving portion of the bonding arm and the pressurizing member to cause the bonding arm to hold the pair of capillary holding portions and the bonding tool.
地址 Hamura-shi, Tokyo JP