| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is easy to mold/process and gives a cured product having sufficient heat resistance and thermal conductivity when cured.SOLUTION: The present invention relates to: the epoxy resin composition which contains at least an epoxy resin represented by the following formula 1 and an insulating filler having a thermal conductivity of 10 W/m K at 25°C; and a cured product obtained by curing the epoxy resin composition. (In the formula, Rto Reach independently represent a hydrogen atom, an optionally substituted alkyl group, an optionally substituted alkenyl group, an optionally substituted alkynyl group, an optionally substituted aryl group, an optionally substituted alkoxy group, an optionally substituted aryloxy group, an optionally substituted acyl group, an optionally substituted alkylcarbonyloxy group, a hydroxy group, or a halogen atom, and at least one of Rto Ris not a hydrogen atom.)</p> |
