| 摘要 |
The present invention relates to a light emitting diode package and, more specifically, to a light emitting diode package capable of minimizing light reflectance reduction and light absorption loss. The light emitting diode package according to the present invention is configured to comprise a lead frame having a first portion and a second portion which are spaced apart from each other, a light emitting diode chip which is mounted on the upper surface of a first portion; an electrostatic prevention chip which is electrically connected to the light emitting chip and mounted on the upper surface of a second portion; a housing which is formed to surround the light emitting diode chip and the electrostatic prevention chip; a first encapsulating material which is formed to cover the electrostatic prevention chip; and a second encapsulating material which is formed to cover the first encapsulating material and the light emitting diode chip. The present invention can improve the light efficiency by preventing the light emitted from the LED chip form being absorbed by the electrostatic prevention chip. |
