RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, AND METAL-CLAD LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for a printed wiring board, capable of forming a substrate material which has a low CTE while securing good moldability.SOLUTION: The resin composition for a printed wiring board contains: a thermosetting resin containing an epoxy resin; a curing agent; an inorganic filler; and an expansion relieving component comprising an acrylic resin soluble in an organic solvent. The content of the inorganic filler is 150 pts.mass or more based on 100 pts.mass of the total of the thermosetting resin and the curing agent. The resin composition for a printed wiring board has a melt viscosity of less than 50,000 Ps at 130°C.