发明名称 WAFER HANDLING APPARATUS
摘要 <p>Disclosed is a wafer support and alignment apparatus. The wafer support and alignment apparatus includes a wafer support component adapted to seat, align and support a wafer. The wafer support component includes at least one flat portion to support the wafer, at least one alignment lip portion protruding upward from the at least one flat portion, and at least one recessed pocket carved out of a portion of the at least one base portion. The at least one recessed pocket is adapted to receive at least one pad.</p>
申请公布号 WO2014164776(A1) 申请公布日期 2014.10.09
申请号 WO2014US23456 申请日期 2014.03.11
申请人 VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. 发明人 PERGANDE, PAUL E.;CARLSON, CHARLES T.
分类号 H01L21/68;H01L21/677 主分类号 H01L21/68
代理机构 代理人
主权项
地址