METHODS FOR THE RECYCLING OF WIRE-SAW CUTTING FLUID
摘要
A process is provided for treating coolant fluid used in wire-saw cutting of semiconductor wafers and which contains silicon-containing impurities. The process comprises changing the properties of the used coolant fluid so that the silicon-containing impurities may be filtered and separated from the coolant fluid to thereby yield a coolant fluid filtrate suitable for use in a wire-saw cutting operation.
申请公布号
WO2014081946(A3)
申请公布日期
2014.10.09
申请号
WO2013US71270
申请日期
2013.11.21
申请人
MEMC SINGAPORE PTE, LTD.;GRABBE, ALEXIS
发明人
GRABBE, ALEXIS;KWESKIN, SASHA, JOSEPH;SHIVE, LARRY, WAYNE;ERK, HENRY, FRANK