发明名称 Lead-free and cadmium-free electroless plating solution, method of electroless plating using the same, and nickel plating layer using the same
摘要 The present invention provides a lead-free and cadmium-free electroless nickel plating solution that has eco-friendly and improved stability of a nickel plating solution and has excellent plating characteristics. The lead-free and cadmium-free electroless nickel plating solution according to an embodiment of the present invention comprises a nickel metal salt for providing nickel ions for plating; a reducing agent for reducing the nickel ions for plating; a complex forming agent for forming a complex with nickel ions for plating and including carboxylic acid and alpha hydroxyl acid; and a lead-free and cadmium-free metal stabilizer for inhibiting the reduction of the nickel ions for plating and including an metal element.
申请公布号 KR101447110(B1) 申请公布日期 2014.10.08
申请号 KR20120126226 申请日期 2012.11.08
申请人 发明人
分类号 C23C18/16;C23C18/31 主分类号 C23C18/16
代理机构 代理人
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