| 发明名称 | Micromechanical component and manufacturing method for a micromechanical component | ||
| 摘要 | A micromechanical component having a fixing point and a seismic weight, which is connected to the fixing point by at least one spring and is made at least partially out of a first material, the first material being a semiconductor material, the seismic weight being additionally made out of at least one second material, and the second material having a higher density than the first material. In addition, a manufacturing method for a micromechanical component is provided, having the steps of forming a seismic weight at least partially out of a first material, the first material being a semiconductor material, connecting the seismic weight to a fixing point of the micromechanical component, using at least one spring, and forming the seismic weight from the first material and at least one second material, which has a higher density than the first material. | ||
| 申请公布号 | US8850891(B2) | 申请公布日期 | 2014.10.07 |
| 申请号 | US201113288750 | 申请日期 | 2011.11.03 |
| 申请人 | Robert Bosch GmbH | 发明人 | Reinmuth Jochen |
| 分类号 | G01P15/125;B81B3/00;G01P15/18;G01P15/08 | 主分类号 | G01P15/125 |
| 代理机构 | Kenyon & Kenyon LLP | 代理人 | Kenyon & Kenyon LLP |
| 主权项 | 1. A micromechanical component, comprising: a fixing point; and a seismic weight surrounding the fixing point and connected to the fixing point by at least one spring, the seismic weight being made at least partially out of a first material, the first material being a semiconductor material, and being additionally made out of at least one second material, the second material having a higher density than the first material, wherein the second material and the first material are chemically bonded to one another. | ||
| 地址 | Stuttgart DE | ||