主权项 |
1. A liquid ejection apparatus comprising:
at least one liquid ejection head each having:
a plurality of nozzles arranged in a nozzle-row direction;a plurality of liquid channels respectively communicating with the plurality of nozzles; anda plurality of ejection-energy applying portions respectively corresponding to the plurality of liquid channels and arranged in the nozzle-row direction; a drive IC configured to drive the plurality of ejection-energy applying portions; a control circuit board configured to control the drive IC; a flexible wiring member on which the drive IC is mounted, the wiring member including: a plurality of drive wirings for respectively connecting the plurality of ejection-energy applying portions and the drive IC to each other; and a control wiring for connecting the drive IC and the control circuit board to each other, the wiring member having a length longer than that of the drive IC in the nozzle-row direction, the wiring member being provided at least between the plurality of ejection-energy applying portions and the control circuit board; and a support member configured to support the wiring member, wherein the plurality of ejection-energy applying portions and the control circuit board are disposed so as to be distant from each other in a first direction that intersects the nozzle-row direction, wherein the wiring member extends toward the control circuit board from a connection portion thereof connected to the plurality of ejection-energy applying portions, the wiring member having a first wiring portion extending in the first direction and a second wiring portion extending in a second direction that intersects the first direction, wherein the support member is configured to support at least one of the first wiring portion and the second wiring portion of the wiring member, the at least one being located between the plurality of ejection-energy applying portions and the control circuit board, wherein the support member is configured to fix and support the plurality of ejection-energy applying portions, wherein the support member extends to a position that is nearer to the control circuit board than the plurality of ejection-energy applying portions in the first direction, and wherein the support member is configured to support the wiring member at a position that is nearer to the control circuit board than the plurality of ejection-energy applying portions. |