发明名称 TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSERTION/EXTRACTION PERFORMANCE
摘要 A tin-plated copper-alloy terminal material having an excellent insertion and extraction performance, which has a dynamic friction coefficient of 0.3 or less while displaying excellent electrical connection characteristics, is provided. The tin-plated copper-alloy terminal material includes a Sn-based surface layer formed on a surface of a substrate made of a Cu alloy, and a Cu-Sn alloy layer formed between the Sn-based surface layer and the substrate. The Cu-Sn alloy layer includes Cu6Sn5 as a main component, in which a part of Cu in the Cu6Sn5 is substituted by Ni and Si in the vicinity of a boundary face at the substrate side. An arithmetic average roughness (Ra) of the Cu-Sn alloy layer is 0.3μm or more in at least one direction, an arithmetic average roughness (Ra) in all directions is 1.0μm or less, an oil-sump depth (Rvk) of the Cu-Sn alloy layer is 0.5μm or more, an average thickness of the Sn-based surface layer is 0.4μm or more and 1.0μm or less and dynamic friction coefficient is 0.3 or less.
申请公布号 KR20140117274(A) 申请公布日期 2014.10.07
申请号 KR20140029378 申请日期 2014.03.13
申请人 MITSUBISHI MATERIALS CORP. 发明人 KATO NAOKI;INOUE YUKI;TARUTANI YOSHIE
分类号 C25D5/10;C25D3/30 主分类号 C25D5/10
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