| 摘要 |
<p>The present invention relates to an alkali soluble resin and a photosensitive resin composition, and more specifically, to an alkali soluble resin which essentially includes a compound represented by chemical formula (1) and has acidity of 30 to 150mgKOH/g. The alkali soluble resin provides improved heat resistance, residue characteristics, film retention ratios, chemical resistance, and mechanical properties and is usefully used for photo-curing inks, photosensitive printing plates, various photoresists, color filter photoresists for LCD, a photoresist for a resin black matrix, a transparent photosensitive material, or the like.</p> |
