发明名称 APPARATUS OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE LIGHT EMITTING DEVICE PACKAGE USING THE SAME
摘要 An apparatus for manufacturing a light emitting deice package includes: a mounting unit which is formed to allow a plurality of light emitting devices to be mounted on a first package substrate; and a test unit that receives the first package substrate including the first light emitting devices formed thereon from the mounting unit, determines whether the first light emitting devices are defective or not by assessing electrical and optical properties of the first light emitting devices, and generates information about defective light emitting devices.
申请公布号 KR20140116244(A) 申请公布日期 2014.10.02
申请号 KR20130023941 申请日期 2013.03.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, JU KYUNG;KIM, YONG;KIM, DAE YOUNG;LIM, JAE YUN
分类号 H01L33/48;G01R31/26 主分类号 H01L33/48
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