| 摘要 |
This sputtering device (1) is provided with: a vacuum chamber (2); a plurality of targets (8) (8a-8d); a shield (9) for selectively exposing only the target (8c) for film formation within the vacuum chamber (2); a substrate holding unit (11) that holds a substrate (10) at which minute particles flying out from the target (8c) form a film; a first moving unit (14) that moves and holds immobile the substrate holding unit (11); a mask (16) disposed between the target (8c) and the substrate (10); a second moving unit (19) that moves the mask (16)); and a plurality of through-hole units (17a-17f) comprising through-holes (17) that penetrate the mask (16) in a patterned manner. |
