| 摘要 |
The invention provides a thermosetting resin composition which inhibits the tackification of the viscosity over time, fills holes of a printed circuit board and has an excellent abrasive property after having been cured, and a printed circuit board filled with the same. The thermosetting resin composition of this invention is characterized in that it comprises (A) an epoxy resin not having an alicyclic skeleton, (B) an epoxy resin having an alicyclic skeleton, (C) a curing catalyst, and (D) a filler. |
