| 发明名称 |
SPUTTERING APPARATUS |
| 摘要 |
A sputtering apparatus capable of effectively reducing damage of a target in a sputtering process includes a first magnet assembly extending in a first direction and having a first side surface and a second side surface extending in the first direction, which correspond to each other, and has a first bottom surface extending in the first direction, which connects the first and second side surfaces; a first shield on the first side surface of the first magnet assembly; and a first supporter for supporting a first end and a second end of a first cylindrical tubular target, the first cylindrical tubular target having a first longitudinal axis parallel to the first direction, the first cylindrical tubular target accommodating the first magnet assembly and the first shield. |
| 申请公布号 |
US2014291146(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201313945779 |
申请日期 |
2013.07.18 |
| 申请人 |
Samsung Display Co., Ltd. |
发明人 |
Sim Jae-Yun;Choi Seung-Ho |
| 分类号 |
C23C14/35 |
主分类号 |
C23C14/35 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sputtering apparatus comprising:
a first magnet assembly extending in a first direction, comprising a first side surface and a second side surface each extending in the first direction, which correspond to each other, and comprising a first bottom surface extending in the first direction, which connects the first side surface and the second side surface; a first shield on the first side surface of the first magnet assembly; and a first supporter for supporting a first end and a second end of a first cylindrical tubular target, the first cylindrical tubular target having a first longitudinal axis parallel to the first direction, wherein the first cylindrical tubular target accommodates the first magnet assembly and the first shield. |
| 地址 |
Yongin-City KR |
